Methods for planarizing a semiconductor contactor

ABSTRACT

A planarizer for a probe card assembly. A planarizer includes a first control member extending from a substrate in a probe card assembly. The first control member extends through at least one substrate in the probe card assembly and is accessible from an exposed side of an exterior substrate in the probe card assembly. Actuating the first control member causes a deflection of the substrate connected to the first control member.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the invention

[0002] The present invention relates generally to a probe card assembly,and more specifically to achieving a more planar relationship betweenthe contact elements on a probe card assembly and a device under test.

[0003] 2. Background Information

[0004] Individual semiconductor devices (dies) are typically produced bycreating several identical devices on a semiconductor wafer, usingcommonly known techniques such as photolithography and deposition.Generally, these processes are intended to create fully functionalintegrated circuit devices, prior to separating the individual dies fromthe semiconductor wafer. However, physical defects in the wafer anddefects in the processing of the wafer often lead to the presence ofsome defective dies on the wafer. It is desirable to be able to identifythe defective dies prior to packaging or prior to their separation fromthe wafer. To perform such identification, wafer testers or probers areused to make pressure connections to connection pads bond pads) on thedies. The dies can then be tested for defects. A conventional componentof a wafer tester is a probe card which has contact elements that effectthe pre sure connections to the bond pads of the dies.

[0005] A probe card can be part of a probe card assembly, such as thatwhich is described in U.S. Pat. No. 5,974,662, titled “Method ofPlanarizing Tips of Probe Elements of a Probe Card Assembly,” which isincorporated by reference herein. A probe card assembly according toU.S. Pat. No. 5,974,662 typically includes a number of components inaddition to the probe card itself, such as an interposer and a spacetransformer. The interposer is disposed between the probe card and thespace transformer and allows the orientation of the space transformer tobe adjusted relative to the orientation of the probe card.

[0006] The space transformer permits a plurality of contact structureson one side of the space transformer to make contact with the terminalsof an electronic component (e.g. bond pads on a semiconductor device) ata relatively fine pitch, while connections to another side of the spacetransformer are made at a relatively coarser pitch. In a preferredembodiment, the contact structures make contact with an activesemiconductor device, such as a wafer. Such connections can be disruptedby slight variations in the planarity of the space transformer.Unfortunately, variations in the planarity of the space transformer canoccur, for example, when the space transformer is manufactured. Forexample, an edge of the space transformer might be bent slightly or thecenter of the space transformer might be bowed.

[0007]FIG. 1 illustrates generally a prior art technique for adjustingthe orientation of a space transformer. A space transformer 110 is shownwith different sets of adjustment points on the bottom of spacetransformer 110. In one example, the adjustment points correspond to thelocations of ball bearings that can be pressed against a back surface ofspace transformer 110 to adjust the orient tion of space transformer110. In FIG. 1, three adjustment points 112 a-112 c are used to adjustthe orientation of space transformer 110. Adjustment points 112 a-112 c,are located along the periphery of space transformer 110.

[0008] The adjustment points shown in FIG. 1 can be used to deflectperipheral areas of space transformer 110, but they cannot be used todeflect non-peripheral areas, such as the center, of space transformer110. The three points of adjustment shown in FIG. 1 define a plane whichis approximately parallel to the plane of a front surface of spacetransformer 110. However, because there are only three adjustmentpoints, they can adjust the orientation, but not the shape, of spacetransformer 110; geometric changes are made on only a low order (1^(st)order polynomial). Furthermore, using ball bearings in conjunction withthe adjustment points provides for the application of only a pushingforce against space transformer 110, and in some instances, the pushingforce is opposed by a spring member on an opposite side of spacetransformer 110.

[0009] In many instances, it is desirable to be able to apply a pullingor pushing force at a multiplicity of locations on a space transformerbecause the space transformer may require deflection or distortion overits surface to achieve better planarity and correct surface variations.

SUMMARY OF THE INVENTION

[0010] The present invention provides, in one embodiment, a method ofadjusting the planarity of a substrate in a probe card assembly, inwhich the method includes deflecting at least one of a first area of thesubstrate, a second area of the substrate, a third area of thesubstrate, and a fourth area of the substrate, and the deflectingincludes applying a pulling force to at least one of the first, second,third and fourth areas of the substrate.

[0011] The present invention provides, in another embodiment, a methodof achieving a degree of planarity among contact portions of a pluralityof contact structures mounted to a substrate, in which the methodincludes creating the substrate with the plurality of contact structuresconnected to a first surface of the substrate, the contact portions ofthe contact structures having a first planar relationship relative toone another, and applying a plurality of forces selectively to thesubstrate to deform the substrate and achieve a second planarrelationship of the contact portions of the contact structures relativeto one another

[0012] Additional features and benefits of the present invention willbecome apparent upon review of the following description.

BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Various embodiments of the present invention will be described indetail with reference to the following drawings in which like referencenumerals refer to like elements. The present invention is illustrated byway of example and not limitation in the accompanying figures. It shouldbe noted that many of the features shown in the figures have not beendrawn to scale for the purpose of better illustrating such features.

[0014]FIG. 1 illustrates generally a prior art technique for adjustingthe planarity of a space transformer in a probe card assembly.

[0015]FIG. 2 illustrates a cross-sectional view of a probe card assemblyin accordance with the teachings of the present invention.

[0016]FIGS. 3A and 3B illustrate generally deflections of a substrate ina probe card assembly in accordance with the teachings of the presentinvention.

[0017]FIG. 4A illustrates a bottom view of a probe card assembly inaccordance with the teachings of the present invention.

[0018]FIG. 4B illustrates a bottom view of a substrate in the probe cardassembly shown in FIG. 4A.

[0019]FIGS. 5A-5C illustrate different embodiments of a planarizingelement for a probe card assembly in accordance with the teachings ofthe present invention.

[0020]FIG. 6 illustrates multiple adjustable substrates of a probe cardassembly.

[0021]FIG. 7A illustrates a top view of a multiple substrate assembly inaccordance with the teachings of the present invention.

[0022]FIG. 7B illustrates a side view of the multiple substrate assemblyshown in FIG. 7A.

DETAILED DESCRIPTION

[0023] The following description provides embodiments of the presentinvention. However, it will be appreciated that other embodiments of thepresent invention will become apparent to those of ordinary skill in theart upon examination of this description. Thus, the present descriptionand accompanying drawings are for purposes of illustration and are notto be used to construe the invention in a restrictive manner.

[0024] In a preferred embodiment of the present invention, a probe cardassembly includes a probe card, an interposer, a space transformer, adrive plate and a first control member. The interposer is locatedbetween the probe card and the space transformer. The drive plate islocated adjacent to the probe card. A protrusion extends from a centralarea of the bottom surface of the space transformer and through athrough hole in the interposer. The first control member is coupled tothe protrusion and is disposed within the through hole in the interposerand through holes in the probe card and drive plate. The first controlmember has an actuating component rotatably coupled to an end of thefirst control member that is accessible from an exposed side of thedrive plate. A spring is supported by the actuating component to beurged against the drive plate. As the actuating component is rotated andmoved toward the drive plate, the spring is pressed against the driveplate and provides a resistance to the movement of the actuatingcomponent. During this time, the space transformer is pulled toward theinterposer via the first control member coupled to the protrusionextending from the space transformer. Thus, a non-peripheral area of thespace transformer is deflected according to a preferred embodiment ofthe present invention.

[0025]FIG. 2 illustrates a side cross-sectional view of a probe cardassembly 200 in accordance with the teachings of the present invention.A space transformer 210 is held down at its periphery by a clampingframe 212. The top of space transformer 210 may be substantially flushwith the top of frame 212 such that a plurality of resilient contactstructures 211 extending from the top of space transformer 210 canextend above the top surface of frame 212.

[0026] Contact structures 211 each have a contact region for makingcontact with the terminals of an electronic component (e.g. bond pads ona semiconductor device). In one embodiment, contact structures 211 arefree-standing, springable contact elements. It is appreciated that othercontact elements can be used in place of contact structures 211. It ispreferred that such elements are sufficiently coupled to spacetransformer 210 to benefit from the planarizing action associated withthe present invention. For example, posts, pins, pads, terminals andbumps/balls or other contact elements known in the art can be used ascontact elements.

[0027] A clamping spring 214 (e.g. leaf spring) is coupled to a frame218 by screws 216. Spring 214 secures frame 212. A printed wiring board220, such as probe card, is located beneath frame 218 and has a throughhole in its center and through holes at points around the center in aregular pattern. A drive plate 222, which can also act as a stiffeningsubstrate, is coupled to the bottom of board 220. Drive plate 222 has aset of through holes which align with the through holes in board 220.Screws 224 are placed in the outer through holes in both board 220 anddrive plate 222. Ball bearings 226 rest on an end of screws 224 and arepressed against space transformer 210 when screws 224 are screwed towardspace transformer 210.

[0028] An interposer 230 is located between space transformer 210 andboard 220. Interposer 230 has a central through hole. Resilient contactstructures 229 extend from the top of interposer 230 and effect pressureconnections with contact pads 228 located on space transformer 210.Resilient contact structures 231 extend from the bottom of interposer230 and effect pressure connections with contact terminals 234 locatedon board 220. A threaded protrusion or stud 238 extends from the bottomof space transformer 210. Stud 238 may be coupled to space transformer210 or integrally formed with space transformer 210. An extension stud240 has a threaded bore in one end which is screwed onto stud 238. Theother end of stud 240 is threaded and accommodates an actuating nut 242.Stud 240 is disposed through the central through holes of interposer230, board 220 and drive plate 222. A spring element 244 (e.g.Belleville washer) is supported by nut 242 and is pressed against driveplate 222 as nut 242 is moved up stud 240.

[0029] It is appreciated that a plurality of resilient contactstructures can be provided on the bottom surface of a space transformer(e.g. fabricated on the terminals on the bottom surface of a spacetransformer) to make direct contact to the terminals on the top surfaceof a printed wiring board. Thus, the use of an interposer is optional.One alternative to an interposer is a semi-rigid support member thatbacks a flexible sheet incorporating contact structures. The semi-rigidsupport member, and hence the flexible sheet and contact structures, canbe planarized in accordance with the teachings of the present invention.Other alternatives to an interposer include flex tape, pogo pins andother socket or interconnect constructions.

[0030] More detailed discussions of printed wiring boards (e.g. probe,cards), interposers, space transformers, drive plates, resilient contactstructures, contact elements and other components of a probe cardassembly that can be used in conjunction with the present invention canbe found in U.S. Pat. No. 5,974,662, U.S. Patent Application No.08/920,255, titled “Making Discrete Power Connections to a SpaceTransformer of a Probe Card Assembly,” now U.S. Patent No. ______, andU.S. patent application Ser. No. 09/042, 606, titled “Probe CardAssembly and Kit,” now U.S. Patent No. ______, all of which areIncorporated by reference herein.

[0031] The planarity of space transformer 210 can be adjusted viaperipheral control members (e.g. screws 224 and ball bearings 226) and anon-peripheral control member (e.g. stud 240 coupled to stud 238).

[0032] For example, screws 224 can be accessed from the bottom side ofdrive plate 222 to drive them upward and force ball bearings 226 againstspace transformer 210. Because space transformer 210 is held by frame212 and spring 214, the contact of ball bearings 226 against spacetransformer 210 subjects space transformer 210 to compressive forces.Thus, when ball bearings 226 are pressed against space transformer 210,space transformer 210 deflects accordingly. Because ball bearings 226are located near the periphery of space transformer 210, only peripheralareas of space transformer 210 are adjustable via screws 224 and ballbearings 226. Furthermore, because screws 224 are accessible from anexposed side of drive plate 222, the planarity of peripheral areas ofspace transformer 210 is remotely adjustable. It should be noted thatscrews 224 and ball bearings 226 can be used to deflect spacetransformer 210 without interfering with interposer 230.

[0033] A central area of space transformer 210 can be deflected throughthe actuation of nut 242. As nut 242 is turned and moves up extensionstud 240, spring element 244 is pressed against drive plate 222 by nut242. Spring element 244 provides a resistance to the upward movement ofnut 242. Thus, as nut 242 is turned around the threads of stud 240 andurged against spring element 244, stud 240 is pulled down. Because stud240 is coupled to stud 238, the area of space transformer 210 where stud238 is located is also pulled down along with stud 240. Thus, such areaof space transformer 210 is subjected to a pulling force or tensileforce. If space transformer 210 is bowed (e.g. domed), then stud 240 canbe pulled down through the actuation of nut 242 to adjust the planarityof space transformer 210. It should be noted that because nut 242 isaccessible from an exposed side of drive plate 222, the planarity of anon-peripheral area of space transformer 210 is remotely adjustable. Itshould be further noted that studs 238 and 240 can be used to deflectspace transformer 210 without interfering with interposer 230.

[0034] Stud 238 can be located at a variety of positions on the bottomsurface of space transformer 210. For example, stud 238 can be locatednear the center or the edge of the bottom surface of space transformer210. Thus, it is appreciated that the planarizing apparatus of thepresent invention can be used to deflect peripheral areas, as well asnon-peripheral areas, of a substrate in a probe card assembly.Furthermore, multiple studs can be used. A space transformer can beconfigured to use a system in which as many as all of the studs or otherelements fixed to the space transformer provide pushing and pullingforces through an actuating mechanism to effect the desired deformationof a surface of the space transformer.

[0035] Screws 224 and ball bearings 226 cannot be used to pull down acentral area of space transformer 210 because they are configured tofunction with an opposing spring against space transformer 210. Theplanarizing apparatus of the present invention addresses such adeficiency as described above. Thus, the planarity of space transformer210 can be more thoroughly adjusted, particularly on a higher order ofadjustment (e.g. 2^(nd) order polynomial, 3^(rd) order polynomial,etc.), with the planarizing apparatus of the present invention.

[0036] In addition to being able to adjust the planarity of spacetransformer 210, the planarizing apparatus of the present invention canbe used to deflect space transformer 210 such that the contact regionsof contact structures 211 are planarized relative to one another. Theplanarization of the contact regions of contact structures 211 allowsmore uniform contact to be made with the terminals of an electroniccomponent to facilitate testing of the electronic component.Furthermore, the deflection of space transformer 210 can effect moreuniform contact between contact pads 228 and contact structures 229, andbetween terminals 234 and contact structures 231.

[0037]FIGS. 3A and 3B illustrate generally a bowed substrate 310, suchas a space transformer, which is typically located in a probe cardassembly. If substrate 310 is bowed as shown in FIG. 3A, then a force332 (e.g. tensile force) which does not directly affect an adjacentinterposer 330 can be applied to substrate 310 to pull substrate 310into a desired position. Specifically, a central area of substrate 310can be deflected to a desired planarity. Such a pulling force can beapplied as previously described in conjunction with FIG. 2. If substrate310 is bowed as shown in FIG. 3B, then a force 334 (e.g. compressiveforce) which does not affect interposer 330 can be applied to substrate310 to push substrate 310 into a desired position. Specifically, acentral area of substrate 310 can be deflected to a desired planarity.Such a pushing force can be applied using an embodiment of the presentinvention as shown in FIG. 5C.

[0038]FIG. 4A illustrates a bottom view of a probe card assembly fittedwith push-only control members 424, which are similar to screws 224, anda push-pull control member 440, which is similar to extension stud 240.A drive plate 422 is coupled to a probe card 420. Both drive plate 422and probe card 420 have through holes to accommodate control members 424and 440. Control members 424 drive ball bearings 426 at correspondinglocations of a substrate 410, as shown in FIG. 4B. Substrate 410, suchas a space transformer, is typically part of a probe card assembly suchas that shown in FIG. 2. A stud 428 extending from the surface ofsubstrate 410 is coupled to central control member 440 to allow acentral area of substrate 410 to be deflected by the actuation of a nut442 relative to control member 440. Control members 424 and 440 can bedriven independently to adjust the planarity of substrate 410 in avariety of ways.

[0039]FIGS. 5A-5C illustrate various embodiments of a planarizingapparatus according to the present invention. In FIG. 5A, a substrate510, such as a space transformer, has a stud 538 a coupled to orintegrally formed with the bottom surface of substrate 510. Stud 538 ahas a threaded bore to accommodate a connector 540 a having threadedends. A nut 542 coupled to one of the threaded ends of connector 540 asupports a spring element 544 a, which can be pressed against asubstrate (not shown), such as a drive plate, in a manner similar tothat described in conjunction with FIG. 2. The actuation of nut 542relative to connector 540 a and the resulting resistance provided byspring element 544 a help drive connector 540 a down, thereby deflectingsubstrate 510. Spring element 544 a Is shown as a Belleville washer. Itis appreciated that other springs elements, such as coil springs andwavy washers could be used in lieu of a Belleville washer. Furthermore,the spring element could be built into the bottom of the drive plate.

[0040] In FIG. 5B, substrate 510 has a threaded stud 538 b coupled to orintegrally formed with the bottom surface of substrate 510. A connector540 b with a threaded bore is coupled to stud 538 b. A nut 542 coupledto a threaded end of connector 540 b supports spring elements 544 b-544d against a substrate (not shown), such as a drive plate. Differentspring elements can be used as spring elements 544 b-544 d to providevarying resistances to nut 542 as nut 542 is twisted along the threadsof connector 540 b toward space transformer 510.

[0041] In FIG. 5C, substrate 510 has a threaded stud 538 c coupled to orintegrally formed with the bottom surface of substrate 510. A connector540 c with a threaded bore is coupled to stud 538 c. A threaded end ofconnector 640 c is coupled to a threaded through hole in a substrate522, such as drive plate. Connector 540 c is accessible from an exposedside of substrate 522, which is typically an exterior substrate of aprobe card assembly. Connector 540 c can be turned clockwise orcounterclockwise to deflect substrate 510 in opposite directions.

[0042] It should be noted that a multipoint adjustment scheme accordingto the present invention can also be used to modify the orientation(e.g. in x, y and θ directions) of a substrate in a probe card assemblywith respect to other substrates in the assembly without interferingwith the planarity or orientation of such other substrates. Accordingly,a probe card assembly having multiple deformable substrates may beconstructed and made planar across the surface defined by their contactelements with respect to a test substrate, while appropriate positionsof the contact elements from substrate to substrate are maintained. Suchan assembly is shown generally in FIG. 6.

[0043] Multiple substrates 610, 620 . . . n are located adjacent to oneanother in a combined assembly. Each substrate is adjustable withrespect to the other substrates in x, y and 0 using orienting mechanisms(not shown) well known in the art. A system for deforming substrates inthe z direction (out of the page) is also included but is not shown.Such a system may incorporate planarizing elements as disclosed herein.The vector r defines the relationship between corresponding contactelements 610 a, 620 a . . . z on multiple substrates 610, 620 . . . n,respectively. Substrates 610, 620 . . . n are positioned with respect toone another such that r is within a desired degree of accuracy, anddeformed such that the contact tips of contact elements 610 a, 620 a . .. z are coplanar within a desired degree of accuracy in the z direction.

[0044] Referring to FIGS. 7A and 7B, which provide more detailedrepresentations of a combined assembly having multiple substratessimilar to that shown in FIG. 6, contact elements 711 are secured toinsulating support member 705. Contact elements 711 are electricallyconnected by traces 706 to connecting wires 715, which are connected inturn to traces 713 and to tester 760. Contact elements 711 areillustrated as solder balls but of course can take many of the formsdescribed herein. In one preferred embodiment, connecting wires 715 areportions of a multi-stranded flex cable. In another preferredembodiment, connecting wires 715 can be wirebonded connections. In stillanother preferred embodiment, insulating support member 705 ispolyimide, or other flex materials well known in the art.

[0045] Substrate 704 supports insulating support member 705. In onepreferred embodiment, they are secured together. In another preferredembodiment, they can be in close contact, but can move relative to eachother. Substrate 704 is positioned by a push-only control elementcomprising actuator 730 acting on element 724 and ball 726 to pressagainst substrate 704, opposed by spring 712, which in turn is securedto substrate frame 720. Several of these push control elements can beused; two are shown in FIG. 7B for illustrative purposes. Substrate 704also is positioned by a push-pull control element comprising actuator732, element 740, and stud 738, which is secured to substrate 704.Substrate frame 720 is secured to substrate housing 722, which in turnis connected to actuators 730, 732, forming a closed loop system. Byselectively positioning the actuators, the shape of substrate 704 can becontrolled.

[0046] Printed wiring board 750 supports housing 752, which is connectedto positioning element 756, which in turn is connected to substratehousing 722 directly or, as shown, through bridge housing 754.Positioning element 756 is illustrated in stylized form and can includeelements as desired to provide x, y, z, and three degrees of positionalcontrol over substrate housing 722.

[0047]FIG. 7B illustrates a second substrate 704 a as well, withelements as described above. Each substrate 704, 704 a can be adjustedto a desired degree of planarity. Equally well, each substrate 704, 704a can be adjusted to a desired degree of flatness of the contact regionportion of each of contact elements 711. Moreover, substrates 704 and704A can be positioned relative to each other to provide a relativelylarge array of contact elements 711.

[0048] Such a probe card assembly constructed of multiple deformablesubstrates is functionally equivalent to a larger probe card assemblyhaving a much larger (equivalent in area) single substrate. It isimportant to note that deformation of the monolithic substrate in orderto change the spatial relationship of the contact elements residing onit is achieved both by deformation and x, y, z, and θ movement of themultiple substrates and supporting structures in which they reside.

[0049] The planarizing apparatus of the present invention can bemanually actuated or automatically actuated. For example, an actuatormechanism can be connected to a planarizing apparatus (e.g. to theactuating nut) and operated according to signals from a computer system.A greater number of control points driven by such automated planarizingapparatuses can shape a substrate to a higher degree of accuracy.

[0050] Although the present invention has been described with particularreference to probe card assemblies and space transformers in particular,it is appreciated that the present invention is not so limited in itsapplications.

[0051] In the foregoing detailed description, the apparatus and methodof the present invention have been described with reference to specificexemplary embodiments. However, it will be evident that variousmodifications and changes may be made without departing from the broaderscope and spirit of the present invention. The present specification andfigures are accordingly to be regarded as illustrative rather thanrestrictive.

1-10. (canceled)
 11. A wiring substrate comprising: a substrate material comprising a first surface and a second surface; a plurality of first electrically conductive elements disposed on said first surface; a plurality of second electrically conductive elements disposed on said second surface, wherein ones of said first conductive elements are electrically connected through said substrate material to ones of said second conductive elements; and means, disposed on a first region of said second surface of said substrate material, for engaging a control member whereby one of an adjustable pulling force or an adjustable pushing force is applied to said first region.
 12. The wiring substrate of claim 11, wherein said control member comprises a threaded connector and an actuating nut, and wherein said means comprises a threaded bore configured to engage said threaded connector.
 13. The wiring substrate of claim 11, wherein said control member comprises a connector with a threaded bore and an actuating nut, and wherein said means comprises threading configured to engage said threaded bore.
 14. The wiring substrate of claim 11, wherein said substrate material further comprises a second region on said second surface of said substrate material, wherein said second region is configured to receive an adjustable pushing force or pulling force applied to said second region.
 15. The wiring substrate of claim 11, wherein said substrate material further comprises a plurality of second regions on said second surface of said substrate material, wherein each of said second regions is configured to receive an adjustable pushing force or pulling force applied thereto.
 16. The wiring substrate of claim 15, wherein said first region is located generally in a center of said second surface of said substrate material, and said second regions are located peripherally on said second surface of said substrate material.
 17. The wiring substrate of claim 11, wherein said plurality of first conductive elements are disposed on said first surface of said substrate material at a first pitch, and said plurality of second conductive elements are disposed on said second surface of said substrate material at a second pitch, wherein said first pitch is different than said second pitch.
 18. The wiring substrate of claim 17, wherein said second pitch is finer than said first pitch.
 19. The wiring substrate of claim 11, wherein said first contact elements are pads.
 20. The wiring substrate of claim 19, wherein said second contact elements are pads.
 21. A method of making a wiring substrate, said method comprising: providing a substrate material comprising: a first surface and a second surface, a plurality of first electrically conductive elements disposed on said first surface, and a plurality of second electrically conductive elements disposed on said second surface, wherein ones of said first conductive elements are electrically connected through said substrate material to ones of said second conductive elements; and configuring an extension extending from a first region of said second surface of said substrate material to engage a control member for applying one of an adjustable pulling force or an adjustable pushing force to said first region.
 22. The method of claim 21, wherein said control member comprises a threaded connector and an actuating nut, and wherein said extension comprises a threaded bore configured to engage said threaded connector.
 23. The method of claim 21, wherein said control member comprises a connector with a threaded bore and an actuating nut, and said extension comprises threading configured to engage said threaded bore.
 24. The method of claim 21, wherein said substrate material further comprises a second region on said second surface of said substrate material, wherein said second region is configured to receive an adjustable pushing force or pulling force applied to said second region.
 25. The method of claim 21, wherein said substrate material further comprises a plurality of second regions on said second surface of said substrate material, wherein each of said second regions is configured to receive an adjustable pushing force or pulling force applied thereto.
 26. The method of claim 25, wherein said first region is located generally in a center of said second surface of said substrate material, and said second regions are peripherally located on said second surface of said substrate material.
 27. The method of claim 21, wherein said plurality of first conductive elements are disposed on said first surface of said substrate material at a first pitch, and said plurality of second conductive elements are disposed on said second surface of said substrate material at a second pitch, wherein said first pitch is different than said second pitch.
 28. The method of claim 27, wherein said second pitch is finer than said first pitch.
 29. The method of claim 21, wherein said first contact elements are pads.
 30. The method of claim 29, wherein said second contact elements are pads.
 31. A wiring substrate comprising: a substrate material comprising a first surface and a second surface; a plurality of first electrically conductive elements disposed on said first surface; a plurality of second electrically conductive elements disposed on said second surface, wherein ones of said first conductive elements are electrically connected through said substrate material to ones of said second conductive elements; and a threaded stud extending from a first region of said second surface of said substrate material.
 32. The wiring substrate of claim 31, wherein said stud is configured to engage a control member for applying one of an adjustable pulling force or an adjustable pushing force or pushing force to said first region.
 33. The wiring substrate of claim 32, wherein said control member comprises a threaded connector and an actuating nut, and wherein said threading of said stud is disposed within a bore in said stud, and said threading of said stud is configured to engage said threading of said connector.
 34. The wiring substrate of claim 32, wherein said control member comprises a connector with a threaded bore and an actuating nut, and wherein said threading of said stud is configured to engage said threaded bore.
 35. The wiring substrate of claim 32, wherein said substrate material further comprises a second region on said second surface of said substrate material, wherein said second region is configured to receive an adjustable pushing force or pulling force applied to said second region.
 36. The wiring substrate of claim 32, wherein said substrate material further comprises a plurality of second regions on said second surface of said substrate material, and wherein each of said second regions is configured to receive an adjustable pushing force or pulling force applied thereto.
 37. The wiring substrate of claim 36, wherein said first region is located generally in a center of said second surface of said substrate material, and said second regions are located peripherally on said second surface of said substrate material.
 38. The wiring substrate of claim 32, wherein said plurality of first conductive elements are disposed on said first surface of said substrate material at a first pitch, and said plurality of second conductive elements are disposed on said second surface of said substrate material at a second pitch, wherein said first pitch is different than said second pitch.
 39. The wiring substrate of claim 38, wherein said second pitch is finer than said first pitch.
 40. The wiring substrate of claim 32, wherein said extension is integrally formed with said substrate material.
 41. The wiring substrate of claim 32, wherein said extension is attached to said substrate material. 